The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Aug. 09, 2013
Applicant:

Dalhousie University, Halifax, CA;

Inventors:

Andre B. Bezanson, Halifax, CA;

Robert B. A. Adamson, Halifax, CA;

Jeremy A. Brown, Halifax, CA;

Assignee:

DALHOUSIE UNIVERSITY, Halifax, NS, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); A61B 8/12 (2006.01); A61B 8/00 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
A61B 8/12 (2013.01); A61B 8/4488 (2013.01); H05K 1/189 (2013.01); H05K 3/403 (2013.01); H05K 3/0052 (2013.01); H05K 2203/049 (2013.01); Y10T 29/49151 (2015.01); Y10T 29/49165 (2015.01);
Abstract

To address limitations of conventional transducers, a phased array transducer is provided with a form factor suitable o for packaging into, e.g., an endoscope. A method of manufacture of small packaging transducers is also provided, whereby the overall package size is reduced by electrically connecting signal wires to array electrodes at an angle approximately normal to the array surface, thus largely eliminating the bend radius requirements of conventional printed circuit boards or flex circuits.


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