The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Feb. 16, 2015
Applicant:

Nippon Mektron, Ltd., Tokyo, JP;

Inventor:

Fumihiko Matsuda, Ryugasaki, JP;

Assignee:

NIPPO MEKTRON, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/025 (2013.01); H05K 1/02 (2013.01); H05K 1/115 (2013.01); H05K 3/027 (2013.01); H05K 3/24 (2013.01); H05K 3/40 (2013.01); H05K 3/4053 (2013.01); H05K 2201/05 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10363 (2013.01);
Abstract

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminateincluding an insulating substrateand metal foiland metal foilprovided on main surfaces of the substrate, a step of forming a circuit patternby patterning the metal foil, a step of forming a peelable printing plate layeron the substrateso as to embed the pattern, a step of forming blind holesandwhere the patternis exposed inside by partially removing the printing plate layer, a step of printing conductive paste with the printing plate layeras a printing mask, and filling the conductive pasteinside the blind holes, and a step of peeling off the printing plate layerfrom the metal foil clad laminate


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