The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Dec. 10, 2014
Applicant:

Mitsubishi Heavy Industries Automotive Thermal Systems, Ltd., Tokyo, JP;

Inventors:

Shunsuke Yakushiji, Tokyo, JP;

Hitoshi Tamaki, Tokyo, JP;

Takayuki Takashige, Kiyosu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 41/00 (2006.01); H05K 1/18 (2006.01); F04B 35/04 (2006.01); F04B 39/12 (2006.01); H05K 3/30 (2006.01); F04C 18/02 (2006.01); H02K 11/00 (2016.01); H05K 3/34 (2006.01); F04C 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); F04B 35/04 (2013.01); F04B 39/121 (2013.01); F04C 18/0215 (2013.01); H02K 11/00 (2013.01); H05K 3/305 (2013.01); F04C 23/008 (2013.01); F04C 2240/803 (2013.01); F04C 2240/808 (2013.01); H05K 3/3421 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2045 (2013.01); Y02P 70/613 (2015.11);
Abstract

An affixing structure that reduces costs and reduces the risk of vibration causing damage or the like to electrical connection terminals on an electronic component affixed to a circuit board is provided. In the affixing structure, which is affixed to a circuit board () via a plurality of lead frames () that are part of a transformer (), at least one second side wall perpendicular to a first side wall where the lead frames () are arranged is adhesively supported on the circuit board () by a support (). The height (H) of the part of the support () in contact with the transformer () is greater than or equal to the height (H) of the center of gravity of the electronic component, and the length (L) of the support () in the direction of the first side wall is greater than or equal to the height (H).


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