The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10149379 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 04, 2018

Filed:

Oct. 17, 2014
Applicant:

Noda Screen Co., Ltd., Aichi, JP;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/113 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H05K 2201/09672 (2013.01);
Abstract

A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating layer and the second insulating layer. The sheet capacitor includes a pair of electrodes that sandwich a dielectric. Lead wirings continue to the electrodes, respectively. The lead wirings are disposed on an opposite side of the first or the second insulating layer with respect to the sheet capacitor to overlap the electrodes when viewed from a stacking direction of the multi-layered circuit board. Because the lead wirings are arranged to overlap the electrodes in the stacking direction of the multi-layered circuit board, an ESL of the sheet capacitor is maintained low.


Find Patent Forward Citations

Oyamada, Seisei. (2018). Multi-layered circuit board and semiconductor device (U.S. Patent No. 10149379). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10149379

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