The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Sep. 05, 2013
Applicant:

Mitsubishi Engineering-plastics Corporation, Tokyo, JP;

Inventors:

Takahiro Takano, Kanagawa, JP;

Takahiko Sumino, Kanagawa, JP;

Kentarou Ishihara, Tokyo, JP;

Naohisa Akashi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 101/00 (2006.01); H01Q 1/38 (2006.01); C08K 3/22 (2006.01); H01Q 1/24 (2006.01); C08G 69/26 (2006.01); C08K 7/14 (2006.01); C08L 77/06 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); B29C 59/16 (2006.01); C23C 18/38 (2006.01); B41M 5/26 (2006.01); H05K 3/18 (2006.01); C08L 53/02 (2006.01); B29K 101/12 (2006.01); B29K 509/08 (2006.01); B29L 31/34 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); B29C 59/16 (2013.01); B41M 5/267 (2013.01); C08G 69/265 (2013.01); C08K 3/22 (2013.01); C08K 7/14 (2013.01); C08L 53/02 (2013.01); C08L 77/06 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/38 (2013.01); H01Q 1/243 (2013.01); H05K 3/185 (2013.01); B29K 2101/12 (2013.01); B29K 2509/08 (2013.01); B29L 2031/3456 (2013.01); C08K 3/2279 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2231 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2255 (2013.01); C08K 2003/2296 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 1/165 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/107 (2013.01);
Abstract

Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.


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