The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Oct. 30, 2012
Applicant:

Sumitomo Chemical Company, Limited, Chuo-ku, Tokyo, JP;

Inventors:

Hirohiko Hasegawa, Niihama, JP;

Yasunori Nishida, Niihama, JP;

Yasuo Shinohara, Tsukuba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/16 (2006.01); H01M 2/14 (2006.01); H01M 4/66 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 2/145 (2013.01); H01M 2/166 (2013.01); H01M 2/1646 (2013.01); H01M 2/1653 (2013.01); H01M 2/1686 (2013.01); H01M 4/666 (2013.01); H01M 4/667 (2013.01); H01M 10/052 (2013.01);
Abstract

Provided is a laminated porous film suitable as a non-aqueous electrolyte secondary battery separator, which includes a heat resistant layer excellent in morphological stability at a high temperature and ion permeability and more resistant to fall-off of a filler. A laminated porous film in which a heat resistant layer including a binder resin and a filler and a base porous film including a polyolefin as a principal component are laminated, wherein the filler included in the heat resistant layer substantially consists of an inorganic filler (a) having a primary particle diameter of 0.2 to 1 μm and an inorganic filler (b) having a primary particle diameter of 0.01 to 0.1 μm, and the particle diameter of secondary aggregates of the inorganic filler (b) is not more than 2 times the primary particle diameter of the inorganic filler (a) in the heat resistant layer.


Find Patent Forward Citations

Loading…