The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Aug. 19, 2015
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Rui Hong, Beijing, CN;

Dan Wang, Beijing, CN;

Zhengyin Xu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/524 (2013.01); H01L 27/32 (2013.01); H01L 51/0024 (2013.01); H01L 51/52 (2013.01); H01L 51/56 (2013.01); H01L 2251/301 (2013.01); H01L 2251/558 (2013.01);
Abstract

A packaging method, a display panel, and a display apparatus. The packaging method comprises steps of: forming a frit layer in a packaging area of a first substrate; forming at least a metal thin film and/or at least a silicon thin film on the frit layer formed on the first substrate, and forming at least a metal thin film and/or at least a silicon thin film in a packaging area of a second substrate, wherein one of the outermost thin film formed on the frit layer and the outermost thin film formed is a metal thin film, and the other is a silicon thin film; and vacuum laminating the first substrate and the second substrate, without the use of a laser to irradiate the frit layer during the packaging.


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