The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Jun. 19, 2017
Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Chi-Feng Huang, Tainan, TW;

Ching-Liang Lin, Taoyuan, TW;

Shen-Jie Wang, New Taipei, TW;

Jyun-De Wu, Tainan, TW;

Yu-Chu Li, Chiayi, TW;

Chun-Chieh Lee, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 33/14 (2010.01); H01L 33/20 (2010.01); H01L 33/12 (2010.01); H01L 33/06 (2010.01); H01L 33/02 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01L 33/0025 (2013.01); H01L 33/02 (2013.01); H01L 33/12 (2013.01); H01L 33/14 (2013.01); H01L 33/32 (2013.01);
Abstract

A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure mainly includes a stress control layer disposed between a light emitting layer and a p-type carrier blocking layer. The p-type carrier blocking layer is made from AlGaN (0<x<1) while the stress control layer is made from AlInGaN (0<x<1, 0<y<1, 0<x+y<1). The light emitting layer has a multiple quantum well structure formed by a plurality of well layers and barrier layers stacked alternately. There is one well layer disposed between the two barrier layers. Thereby the stress control layer not only improves crystal quality degradation caused by lattice mismatch between the p-type carrier blocking layer and the light emitting layer but also reduces effects of compressive stress on the well layer caused by material differences.


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