The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Oct. 16, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Keiji Mabuchi, Kanagawa, JP;
Hideshi Abe, Kanagawa, JP;
Hideo Kanbe, Kanagawa, JP;
Shiro Uchida, Tokyo, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 27/30 (2006.01); G01J 5/20 (2006.01); G01J 3/28 (2006.01); G01J 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14652 (2013.01); G01J 5/20 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14612 (2013.01); H01L 27/14636 (2013.01); H01L 27/14649 (2013.01); H01L 27/14683 (2013.01); H01L 27/14687 (2013.01); G01J 3/2803 (2013.01); G01J 3/36 (2013.01); H01L 27/14609 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H01L 27/14647 (2013.01); H01L 27/30 (2013.01); H01L 27/307 (2013.01);
Abstract
A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.