The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Oct. 24, 2016
Applicant:
Palo Alto Research Center Incorporated, Palo Alto, CA (US);
Inventors:
Brent S. Krusor, Fremont, CA (US);
Ping Mei, San Jose, CA (US);
Assignee:
PALO ALTO RESEARCH CENTER INCORPORATED, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2783 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/7532 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75312 (2013.01); H01L 2224/75314 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75316 (2013.01); H01L 2224/75318 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/95091 (2013.01); H01L 2224/95121 (2013.01); H01L 2224/97 (2013.01);
Abstract
The present application provides methods, systems and devices for simultaneously bonding multiple semiconductor chips of different height profiles on a flexible substrate.
Krusor, Brent. (2018). Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste (U.S. Patent No. 10147702). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10147702
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile