The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Apr. 20, 2016
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Yong Lin, Plano, TX (US);
Sadia Arefin Khan, Addison, TX (US);
Benjamin Stassen Cook, Rockwall, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49558 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49541 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract
An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled to the set of leads. Encapsulating material encloses the semiconductor die, such that the set of pins extend beyond the encapsulating material. An additive coating covers one or more of the plurality of pins.