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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10147662 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Oct. 29, 2015

Circuit board and electronic device provided with same

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Yuuichi Abe, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:

Viering, Jentschura & Partner MBB

Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/36 (2006.01); H01L 23/13 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H05K 1/16 (2006.01); H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H05K 1/11 (2013.01); H05K 3/40 (2013.01); H05K 3/46 (2013.01); H01L 23/3731 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H05K 1/02 (2013.01); H05K 1/183 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/20 (2013.01);
Abstract

A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.

Find Patent Forward Citations

Abe, Yuuichi. (2018). Circuit board and electronic device provided with same (U.S. Patent No. 10147662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10147662

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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