The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Nov. 14, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hidehiko Karasaki, Osaka, JP;

Hidefumi Saeki, Osaka, JP;

Atsushi Harikai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/2686 (2013.01);
Abstract

A manufacturing process of an element chip comprises a preparation step for preparing a substrate, the substrate including first and second streets crossing each other to define a plurality of element regions. Also, it comprises a first shallow-groove formation step for radiating a laser beam along the first streets to form a plurality of first shallow grooves being shallower than a thickness of the substrate, a second shallow-groove formation step for radiating the laser beam along the second streets to form a plurality of second shallow grooves being shallower than a thickness of the substrate, a first groove formation step for radiating the laser beam along the first shallow grooves to form a plurality of first grooves, and a plasma dicing step for etching the substrate along the first grooves and the second shallow grooves by a plasma exposure to dice the substrate into a plurality of element chips.


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