The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Oct. 15, 2014
Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;
Kentaro Takahashi, Tokyo, JP;
Megumi Ootomo, Tokyo, JP;
SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;
Abstract
Provided is an electrostatic chuck device in which breakdown between an electrostatic chuck portion and a cooling base portion can be prevented, voltage endurance can be improved, uniformity in the in-plane temperature of a mounting surface of the electrostatic chuck portion where a plate-shaped sample is mounted can be improved, and voltage endurance of a heating member can be improved by applying a uniform voltage between the electrostatic chuck portion and the cooling base portion. An electrostatic chuck device () includes: an electrostatic chuck portion () that includes a ceramic plate-shaped body and an internal electrodefor electrostatic adsorption; and a cooling base portion () that adjusts a temperature of the internal electrode () for electrostatic adsorption, in which a first insulating member () is adhered to a second main surface of the ceramic plate-shaped body through a first adhesive () so as to cover a periphery of the internal electrode for electrostatic adsorption (), a second insulating member () is adhered to a top surface of the cooling base portion () through a second adhesive (), a heating member () is provided on a top surface of the second insulating member (), and the electrostatic chuck portion () and the cooling base portion () are adhered to each other and integrated through an organic adhesive layer ().