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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10147621 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Sep. 11, 2017

Adhesive tape separating tool, manufacturing apparatus of semiconductor chip, manufacturing apparatus of mems device manufacturing apparatus of liquid ejecting head, and separating method of adhesive tape

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Akira Takada, Matsumoto, JP;

Kazuyuki Harayama, Matsumoto, JP;

Assignee:

Seiko Epson Corporation, Tokyo, JP;

Attorney:

Workman Nydegger

Primary Examiner:

Mark A Osele

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); B41J 2/16 (2006.01); B81C 99/00 (2010.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B32B 43/006 (2013.01); B41J 2/161 (2013.01); B41J 2/1607 (2013.01); B41J 2/1623 (2013.01); B41J 2/1632 (2013.01); B41J 2/1635 (2013.01); B81C 99/0025 (2013.01); H01L 21/6838 (2013.01); H01L 21/6875 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the work, in which a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, and the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work.

Find Patent Forward Citations

Takada, Akira. (2018). Adhesive tape separating tool, manufacturing apparatus of semiconductor chip, manufacturing apparatus of mems device manufacturing apparatus of liquid ejecting head, and separating method of adhesive tape (U.S. Patent No. 10147621). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10147621

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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