The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Dec. 23, 2014
Applicant:

General Cable Technologies Corporation, Highland Heights, KY (US);

Inventors:

Sathish Kumar Ranganathan, Indianapolis, IN (US);

Sujith Murali, Chesterfield, NJ (US);

Jon Michael Malinoski, Zionsville, IN (US);

Scott Edward Frankowski, Fishers, IN (US);

Srinivas Siripurapu, Carmel, IN (US);

Vijay Mhetar, Carmel, IN (US);

Barry Eugene Lawson, Marion, IN (US);

Assignee:

General Cable Technologies Corporation, Highland Heights, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/36 (2006.01); H01B 19/04 (2006.01); H01B 13/14 (2006.01); H01B 3/44 (2006.01); H01B 3/30 (2006.01); H01B 3/46 (2006.01); H01B 3/42 (2006.01); H01B 3/40 (2006.01); H01B 7/04 (2006.01);
U.S. Cl.
CPC ...
H01B 7/36 (2013.01); H01B 3/30 (2013.01); H01B 3/40 (2013.01); H01B 3/421 (2013.01); H01B 3/442 (2013.01); H01B 3/443 (2013.01); H01B 3/445 (2013.01); H01B 3/447 (2013.01); H01B 3/46 (2013.01); H01B 13/141 (2013.01); H01B 13/145 (2013.01); H01B 19/04 (2013.01); H01B 7/041 (2013.01);
Abstract

An electrical cable includes a plurality of conductors forming a conductor core, one or more insulation layers at least partially surrounding at least one of the plurality of conductors, an outer jacket surrounding the conductor core and a film applied to the exterior surface of the outer jacket. The film includes high visibility particles. Methods of forming electrical cables are also described herein.


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