The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Jan. 24, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Andrea Bahgat Shehata, White Plains, NY (US);

Peilin Song, Lagrangeville, NY (US);

Franco Stellari, Waldwick, NJ (US);

Alan J. Weger, Mohegan Lake, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); G06T 11/20 (2006.01); G06K 9/62 (2006.01); G01N 21/956 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06K 9/6267 (2013.01); G06T 11/20 (2013.01); H01L 22/30 (2013.01); H01L 23/57 (2013.01); G01N 2201/13 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A computer-implemented device and method for identifying hardware Trojans and defects based on light emissions from Integrated Circuits (ICs) is provided. A measured emissions map is received based on light emissions captured from a sacrificial test IC. The sacrificial test IC is a partially manufactured IC fabricated to include a set of frontend layers of an IC architecture but not a set of backend layers of the IC architecture. The sacrificial test IC also includes a sacrificial layer for powering devices in the partially manufactured IC without the set of backend layers. An expected emissions map is derived from the sacrificial test IC and the measured emissions map is compared with the expected emissions map to identify deviations from the IC architecture in the frontend layers.


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