The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Sep. 26, 2016
Applicant:
Meas Switzerland S.Ă .r.l., Bevaix, CH;
Inventors:
Jean-Francois le Neal, Neuchatel, CH;
Predrag Drljaca, Neuchatel, CH;
Assignee:
MEAS Switzerland S.a.r.l., Bevaix, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81C 1/00301 (2013.01); B81C 1/00309 (2013.01); B81C 3/005 (2013.01); G01L 9/0054 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81C 2203/031 (2013.01); B81C 2203/0792 (2013.01);
Abstract
A sensor for measuring, for example, the pressure of a gas or other fluid comprising a glass substrate having an aperture defined therethrough. A semiconductor die defining a diaphragm is anodically bonded to the glass substrate such that the diaphragm is exposed via the aperture. At least one electrically conductive element in electrical communication with the semiconductor die is arranged on a surface of the glass substrate.