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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10144203 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Oct. 03, 2013

Pre-formed thermoplastic filler for thermoset structure

Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Gabriel Z. Forston, Lake Stevens, WA (US);

Christopher G. Harris, Auburn, WA (US);

Joshua P. Tyndall, Everett, WA (US);

Hyukbong Kwon, Mukilteo, WA (US);

Carolyn Schmidt, Scottsdale, AZ (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:

Kunzler, PC

Primary Examiner:

Joanna Pleszczynska

Int. Cl.
CPC ...
B32B 7/00 (2006.01); B32B 27/04 (2006.01); B32B 27/08 (2006.01); B32B 5/28 (2006.01); B64C 1/06 (2006.01); B64C 1/12 (2006.01); B32B 27/20 (2006.01); B29C 70/86 (2006.01); B29C 70/08 (2006.01); B32B 7/06 (2006.01); B29C 65/00 (2006.01); B64C 1/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B32B 27/20 (2013.01); B29C 66/721 (2013.01); B29C 66/73941 (2013.01); B29C 70/086 (2013.01); B29C 70/86 (2013.01); B32B 7/06 (2013.01); B32B 27/08 (2013.01); B64C 1/064 (2013.01); B64C 1/12 (2013.01); B29C 66/7212 (2013.01); B29C 66/73115 (2013.01); B29C 66/73117 (2013.01); B29C 66/73756 (2013.01); B29C 66/91411 (2013.01); B29C 66/91935 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3085 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2605/18 (2013.01); B64C 2001/0072 (2013.01); Y02T 50/43 (2013.01); Y10T 428/24529 (2015.01); Y10T 428/249952 (2015.04);
Abstract

An apparatus includes a first thermoset layer that includes a first fibrous material embedded in a first thermoset matrix. The apparatus also includes a second thermoset layer that includes a second fibrous material embedded in a second thermoset matrix. The second thermoset layer is coupled to the first thermoset layer to form a joint. Further, a gap is defined between the first thermoset layer and the second thermoset layer. The apparatus also includes a thermoplastic filler that is made from a thermoplastic material. The thermoplastic filler is positioned within the gap.

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