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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10144163 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Aug. 03, 2018

Connector and method for producing a connector

Applicant:

Protech Gmbh, Pfullingen, DE;

Inventors:

Juergen Mentzel, Pfullingen, DE;

Benjamin Rudin, Pfullingen, DE;

Assignee:

PROTECH GmbH, Pfullingen, DE;

Attorneys:

Jason H. Vick

Sheridan Ross, PC

Primary Examiner:

Tho D Ta

Int. Cl.
CPC ...
H01R 13/405 (2006.01); B29C 45/16 (2006.01); H01R 43/00 (2006.01); B29C 71/02 (2006.01); H01R 43/24 (2006.01); H01R 13/52 (2006.01); B29K 105/24 (2006.01); B29K 105/16 (2006.01); B29C 45/14 (2006.01); B29L 31/26 (2006.01); B29K 77/00 (2006.01); B29K 63/00 (2006.01); B29K 67/00 (2006.01); B29L 31/36 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1671 (2013.01); B29C 45/1657 (2013.01); B29C 45/1676 (2013.01); B29C 71/02 (2013.01); H01R 13/405 (2013.01); H01R 43/005 (2013.01); H01R 43/24 (2013.01); B29C 45/14639 (2013.01); B29C 2045/1678 (2013.01); B29C 2071/027 (2013.01); B29K 2063/00 (2013.01); B29K 2067/006 (2013.01); B29K 2077/00 (2013.01); B29K 2105/16 (2013.01); B29K 2105/243 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/26 (2013.01); B29L 2031/36 (2013.01); H01R 13/521 (2013.01);
Abstract

An aspect of the invention is directed to a method for producing a connector using injection-molding by providing at least one conductor and at least one contact pin which are electrically connected at a contact point, producing a thermoset premold from a thermoset using injection-molding, wherein the thermoset is injection-molded around at least a first section of the at least one conductor and/or around at least a second section of the at least one contact pin, and injection-molding of a thermoplast on the thermoset premold, wherein the step of injection-molding takes place before the thermoset premold has obtained a degree of curing of 90%. Another aspect of the invention is a connector comprising at least one conductor and at least one contact pin is disclosed.

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