The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Jun. 15, 2015
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Yuta Kataoka, Hitachi, JP;

Yukio Ikeda, Hitachi, JP;

Takashi Onimoto, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); H01B 13/06 (2006.01); B29K 75/00 (2006.01); B29K 67/00 (2006.01); B29L 31/34 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0025 (2013.01); H01B 13/06 (2013.01); B29C 45/0046 (2013.01); B29C 45/14426 (2013.01); B29C 45/14467 (2013.01); B29K 2067/006 (2013.01); B29K 2075/00 (2013.01); B29L 2031/3462 (2013.01);
Abstract

A method of manufacturing a cable with resin molded body, wherein the cable with resin molded body includes a cable and a resin molded body formed by resin molding, wherein the resin molded body includes a main body to cover the tip portion of the cable and a flange integrally molded with the main body, and wherein the flange includes a bolt hole through which a bolt is inserted so as to fix the flange to the attachment object. The method includes molding the resin molded body by injecting a resin into a mold, the mold including a main body-molding portion for molding the main body, a flange-molding portion for molding the flange and an outlet formed behind the flange-molding portion in relation to the main body-molding portion, and draining the resin through the outlet during the molding of the resin molded body.


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