The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

May. 04, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kazuo Hattori, Nagaokakyo, JP;

Isamu Fujimoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/012 (2006.01); H01G 4/018 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01G 2/06 (2006.01); H01G 4/224 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/018 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.


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