The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Sep. 16, 2015
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Anthony D. Minervini, Palos Hills, IL (US);

Kieran Harney, Andover, MA (US);

Aleksey S. Khenkin, Nashua, NH (US);

Baris Cagdaser, Sunnyvale, CA (US);

Assignee:

Invensense, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 13/00 (2006.01); G01K 1/14 (2006.01); G01K 1/16 (2006.01); H04R 1/02 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/028 (2013.01); G01K 13/00 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0278 (2013.01); H04R 2231/00 (2013.01);
Abstract

Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.


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