The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Aug. 28, 2017
Applicant:

Fotonation Limited, Galway, IE;

Inventors:

Kartik Venkataraman, San Jose, CA (US);

Amandeep S. Jabbi, San Francisco, CA (US);

Robert H. Mullis, Santa Cruz, CA (US);

Jacques Duparre, Jena, DE;

Shane Ching-Feng Hu, Fremont, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/262 (2006.01); H04N 5/225 (2006.01); H04N 5/247 (2006.01); G02B 13/00 (2006.01); G02B 5/20 (2006.01); H04N 5/365 (2011.01); H04N 13/128 (2018.01); H04N 5/232 (2006.01); H04N 5/33 (2006.01); H04N 5/341 (2011.01); H04N 5/355 (2011.01); H04N 5/357 (2011.01); H04N 9/04 (2006.01); H04N 9/097 (2006.01); G06T 19/20 (2011.01); H04N 9/09 (2006.01); H04N 9/73 (2006.01); H04N 5/265 (2006.01); G06T 11/60 (2006.01); G02B 3/00 (2006.01); G06T 7/557 (2017.01); H04N 5/349 (2011.01); H04N 13/257 (2018.01); H04N 13/00 (2018.01);
U.S. Cl.
CPC ...
H04N 5/247 (2013.01); G02B 3/0056 (2013.01); G02B 3/0062 (2013.01); G02B 5/20 (2013.01); G02B 5/201 (2013.01); G02B 13/0015 (2013.01); G06T 7/557 (2017.01); G06T 11/60 (2013.01); G06T 19/20 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2258 (2013.01); H04N 5/23232 (2013.01); H04N 5/23238 (2013.01); H04N 5/23296 (2013.01); H04N 5/262 (2013.01); H04N 5/265 (2013.01); H04N 5/332 (2013.01); H04N 5/349 (2013.01); H04N 5/3415 (2013.01); H04N 5/357 (2013.01); H04N 5/35545 (2013.01); H04N 5/365 (2013.01); H04N 9/045 (2013.01); H04N 9/09 (2013.01); H04N 9/097 (2013.01); H04N 9/735 (2013.01); H04N 13/128 (2018.05); G06T 2200/04 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/10052 (2013.01); G06T 2207/20221 (2013.01); H04N 13/257 (2018.05); H04N 2013/0081 (2013.01);
Abstract

Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. An imaging device in accordance with one embodiment of the invention includes at least one imager array, and each imager in the array comprises a plurality of light sensing elements and a lens stack including at least one lens surface, where the lens stack is configured to form an image on the light sensing elements, control circuitry configured to capture images formed on the light sensing elements of each of the imagers, and a super-resolution processing module configured to generate at least one higher resolution super-resolved image using a plurality of the captured images.


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