The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Dec. 06, 2017
Applicant:

Radioxio, Llc, Saint Paul, MN (US);

Inventors:

Curtis Ling, Carlsbad, CA (US);

Timothy Gallagher, Encinitas, CA (US);

Glenn Chang, Carlsbad, CA (US);

Assignee:

Radioxio, LLC, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04H 40/90 (2008.01); H04N 5/455 (2006.01); H04L 27/38 (2006.01); H04N 5/44 (2011.01); H04N 21/426 (2011.01); H04L 25/06 (2006.01); H04L 1/00 (2006.01);
U.S. Cl.
CPC ...
H04H 40/90 (2013.01); H04L 1/0048 (2013.01); H04L 25/061 (2013.01); H04L 25/067 (2013.01); H04L 27/38 (2013.01); H04N 5/4401 (2013.01); H04N 5/455 (2013.01); H04N 21/42607 (2013.01); H05K 999/99 (2013.01);
Abstract

A first semiconductor die may comprise an interface circuit and a demodulation circuit. The interface circuit may be operable to receive an externally generated signal and recover decisions of a symbol de-mapper carried in the externally generated signal. The demodulation circuit may be operable to recover one or more transport streams based on the decisions of the symbol de-mapper. The first semiconductor die may comprise circuitry operable to combine a plurality of signals from a plurality of second semiconductor dice, where each of the plurality of signals comprises decisions of a respective one of a plurality of symbol de-mappers.


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