The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Jul. 06, 2017
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Ping Mei, San Jose, CA (US);

David Eric Schwartz, San Carlos, CA (US);

Brent S. Krusor, Fremont, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/78 (2011.01); H01R 12/77 (2011.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H01R 12/50 (2011.01);
U.S. Cl.
CPC ...
H01R 12/78 (2013.01); H01R 12/771 (2013.01); H01R 23/725 (2013.01); H05K 1/028 (2013.01); H05K 1/144 (2013.01);
Abstract

Printed flexible hybrid electronic systems may require electrical interconnection to peripheral elements. For example, a printed sensor tag with wireless communication may need to connect to a printed sensing electrode on a separated substrate. Frequently, it is desired that these interconnections be detachable in order to replace peripheral elements or to facilitate low cost and simplified assembly, test, rework, and repair. Unlike conventional printed circuit board, mounting a connector on a flexible substrate for detachable connection is challenging due to low temperature requirements. Provide is a teaching of a thin film or form of electrical connection for two circuit elements on separate flexible substrates. The connection is detachable and re-attachable for replacing different circuit elements. The detachable connection is in embodiments realized by selective deposition of fine patterns of conductive materials and non-conductive repositionable pressure-sensitive adhesive.


Find Patent Forward Citations

Loading…