The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

May. 23, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Chie Yamamoto, Kanagawa, JP;

Hideki Iwaki, Kanagawa, JP;

Ryosuke Shiozaki, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 21/22 (2006.01); H01Q 1/38 (2006.01); H01Q 3/34 (2006.01); H01Q 9/04 (2006.01); H05K 1/02 (2006.01); H01P 5/02 (2006.01); H01Q 1/32 (2006.01); H01Q 11/04 (2006.01); H01Q 21/06 (2006.01); H01Q 21/08 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/22 (2013.01); H01Q 1/38 (2013.01); H01Q 3/34 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0457 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/0093 (2013.01); H05K 1/0222 (2013.01); H05K 1/0251 (2013.01); H01P 5/028 (2013.01); H01Q 1/3233 (2013.01); H01Q 11/04 (2013.01); H01Q 21/065 (2013.01); H01Q 21/08 (2013.01); H05K 1/0243 (2013.01); H05K 1/0373 (2013.01); H05K 3/4626 (2013.01);
Abstract

An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.


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