The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Jul. 09, 2013
Applicant:

Ngk Insulators, Ltd., Nagoya-Shi, JP;

Inventors:

Tetsuya Hatta, Kuwana, JP;

Tomio Tamakoshi, Kasugai, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/10 (2006.01); H01M 10/39 (2006.01); H01M 10/653 (2014.01); H01M 10/6554 (2014.01); H01M 10/617 (2014.01); H01M 10/627 (2014.01); H01M 10/613 (2014.01); H01M 10/658 (2014.01); H01M 10/60 (2014.01); H01M 10/6563 (2014.01); H01M 10/6566 (2014.01);
U.S. Cl.
CPC ...
H01M 10/50 (2013.01); H01M 2/1088 (2013.01); H01M 2/1094 (2013.01); H01M 10/3909 (2013.01); H01M 10/613 (2015.04); H01M 10/617 (2015.04); H01M 10/627 (2015.04); H01M 10/653 (2015.04); H01M 10/658 (2015.04); H01M 10/6554 (2015.04); H01M 10/6563 (2015.04); H01M 10/6566 (2015.04); H01M 2220/10 (2013.01);
Abstract

A module battery is housed in a module battery housing rack. An electric cell is housed in a container. The container is provided with a high thermal conductive wall and a low thermal conductive wall. A first portion of a plate overlaps the outer surface of the high thermal conductive wall and a second portion of the plate protrudes from the outer surface. The second portion surrounds the first portion. A first main surface of the plate is brought into direct contact with the outer surface at the first portion and it is apart from the container at the second portion. A second main surface of the plate is exposed to a space, to which heat is allowed to radiate. An opening may or may not be formed at the first portion. A thermal conducting medium may be held between the first wall and the first portion.


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