The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Aug. 16, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Tomohide Miki, Tokushima, JP;

Hideki Hayashi, Anan, JP;

Motokiyo Shirahama, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/32 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/32 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing a light emitting device includes: providing a light emitting device set that includes a lead frame being plate-like and including pairs of supporting leads each of which pairs consists of a first supporting lead and a second supporting lead, packages respectively supported by the pairs of supporting leads, and light emitting elements respectively mounted on the packages; and removing the packages from the lead frame. The packages each include a resin molded body, the resin molded body includes a first recess open at the first and third outer surfaces, and a second recess open at the second and third outer surfaces. The first supporting lead and the second supporting lead respectively fit into the first recess and the second recess. In the removing step, the packages are each removed from the lead frame by the third outer surface being pushed.


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