The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Mar. 24, 2015
Corning Precision Materials Co., Ltd., Chungcheongnam-do, KR;
Ki Yeon Lee, Chungcheongnam-do, KR;
Jhee Mann Kim, Chungcheongnam-do, KR;
Hyung Soo Moon, Chungcheongnam-do, KR;
Yoon Seuk Oh, Chungcheongnam-do, KR;
Choon Bong Yang, Chungcheongnam-do, KR;
Abstract
The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing same, the color-conversion substrate of a light-emitting diode comprising: a first substrate arranged on a light-emitting diode; a second substrate disposed facing the first substrate; a first sealing material disposed on the upper surface of the first substrate so as to section a grooved accommodating space having the first substrate as the bottom surface thereof; QDs filling the accommodating space; and a second sealing material, disposed between the second substrate and the first sealing material, having a shape corresponding to the first sealing material, wherein the second sealing material is made of material having a comparatively higher laser absorption rate in the infrared region than that of the first sealing material.