The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Sep. 11, 2018
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, Jiangsu, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

I-Chen Chien, Keelung, TW;

Shih-Chang Hsu, Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 24/95 (2013.01); H01L 33/483 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.


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