The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Nov. 09, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Niladri Narayan Mojumder, San Diego, CA (US);

Ritu Chaba, San Diego, CA (US);

Ping Liu, San Diego, CA (US);

Stanley Seungchul Song, San Diego, CA (US);

Zhongze Wang, San Diego, CA (US);

Choh Fei Yeap, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11 (2006.01); G11C 8/14 (2006.01); G11C 11/418 (2006.01); H01L 27/02 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); G11C 8/16 (2006.01); G11C 11/419 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1104 (2013.01); G11C 8/14 (2013.01); G11C 8/16 (2013.01); G11C 11/418 (2013.01); G11C 11/419 (2013.01); H01L 21/3213 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/0207 (2013.01); H01L 27/11 (2013.01);
Abstract

An apparatus includes a first metal layer coupled to a bit cell. The apparatus also includes a third metal layer including a write word line that is coupled to the bit cell. The apparatus further includes a second metal layer between the first metal layer and the third metal layer. The second metal layer includes two read word lines coupled to the bit cell.


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