The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Oct. 30, 2015
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Domingo Figueredo, Fernandina Beach, FL (US);
Husnu Masaracioglu, San Jose, CA (US);
Marshall Maple, Cupertino, CA (US);
Deog-Soon Choi, Seoul, KR;
Ashish Alawani, San Jose, CA (US);
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Abstract
A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress.