The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Aug. 15, 2017
Applicant:

Primax Electronics Ltd., Taipei, TW;

Inventor:

Tsung-Yi Lu, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/492 (2013.01); H01L 23/4985 (2013.01); H01L 23/564 (2013.01); G06K 9/00006 (2013.01); G06K 9/00013 (2013.01);
Abstract

This application provides a fingerprint recognition module and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly welding the die to the FPC board, and electrically connecting the die to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space and produce a waterproof effect.


Find Patent Forward Citations

Loading…