The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Oct. 21, 2015
Applicant:
Promerus, Llc, Brecksville, OH (US);
Inventors:
Venkat R. Dukkipati, Newport Beach, CA (US);
Xianhe Wei, Medford, MA (US);
Larry F. Rhodes, Brecksville, OH (US);
Assignee:
PROMERUS, LLC, Brecksville, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); B32B 7/10 (2006.01); H01L 21/683 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/06 (2013.01); B32B 7/10 (2013.01); C09J 5/06 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2453/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.