The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jul. 28, 2017
Asahi Glass Company, Limited, Chiyoda-ku, JP;
AGC Inc., Chiyoda-ku, JP;
Abstract
To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A filmwhich comprises a substrateand an adhesive layer, wherein the storage elastic modulus at 180° C. of the substrateis from 10 to 100 MPa, and the adhesive layeris a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles Mof hydroxy groups and the number of moles Mof carboxy groups, derived from the acrylic polymer, and the number of moles Mof isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.