The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Apr. 28, 2016
Applicant:

Nittoku Engineering Co., Ltd., Saitama-shi, Saitama, JP;

Inventor:

Kenichi Muto, Fukushima, JP;

Assignee:

NITTOKU ENGINEERING CO., LTD., Saitama-Shi, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/00 (2006.01); H01F 41/086 (2016.01); H01F 41/092 (2016.01); H01F 41/071 (2016.01); H02K 3/50 (2006.01); H01F 41/098 (2016.01);
U.S. Cl.
CPC ...
H01F 41/086 (2016.01); H01F 41/071 (2016.01); H01F 41/092 (2016.01); H01F 41/098 (2016.01); H02K 3/50 (2013.01);
Abstract

An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.


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