The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Mar. 15, 2013
Applicants:

Kyoung Soo Park, Uiwang-si, KR;

Woo Suk Lee, Uiwang-si, KR;

Woo Jun Lim, Uiwang-si, KR;

Kyung Jin Lee, Uiwang-si, KR;

Bong Yong Kim, Uiwang-si, KR;

Jin Seong Park, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Youn JO Ko, Uiwang-si, KR;

Jang Hyun Cho, Uiwang-si, KR;

Sang Sik Bae, Uiwang-si, KR;

Jin Kyu Kim, Uiwang-si, KR;

Inventors:

Kyoung Soo Park, Uiwang-si, KR;

Woo Suk Lee, Uiwang-si, KR;

Woo Jun Lim, Uiwang-si, KR;

Kyung Jin Lee, Uiwang-si, KR;

Bong Yong Kim, Uiwang-si, KR;

Jin Seong Park, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Youn Jo Ko, Uiwang-si, KR;

Jang Hyun Cho, Uiwang-si, KR;

Sang Sik Bae, Uiwang-si, KR;

Jin Kyu Kim, Uiwang-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01B 3/08 (2006.01); H01B 7/00 (2006.01); H01B 13/00 (2006.01); H01L 23/00 (2006.01); C09J 133/06 (2006.01); C09J 7/10 (2018.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01B 3/082 (2013.01); C09J 7/10 (2018.01); C09J 133/068 (2013.01); H01B 7/00 (2013.01); H01B 13/00 (2013.01); H01L 24/26 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 3/08 (2013.01); C09J 2201/36 (2013.01); C09J 2201/602 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 24/32 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12044 (2013.01);
Abstract

An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.


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