The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Mar. 15, 2016
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventor:
Takuya Hongo, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 20/02 (2006.01); F28F 3/02 (2006.01); H01L 23/36 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01); F28D 20/00 (2006.01); F28D 21/00 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
F28D 20/02 (2013.01); F28F 3/02 (2013.01); H01L 21/4882 (2013.01); H01L 23/36 (2013.01); H01L 23/4275 (2013.01); F28D 2020/006 (2013.01); F28D 2020/0008 (2013.01); F28D 2020/0013 (2013.01); F28D 2021/0029 (2013.01); H01L 23/467 (2013.01); Y02E 60/145 (2013.01);
Abstract
According to one embodiment, a heat dissipation structure includes a heat dissipating unit and a heat accumulating unit. The heat dissipating unit includes at least one extending part which extends in a first direction, and is configured to be thermally connected to an apparatus which is configured to produce heat. The heat accumulating unit includes an accommodating unit which is configured to be thermally connected to the extending part, a heat storage material sealed inside the accommodating unit.