The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jul. 22, 2016
Applicant:
Byd Company Limited, Shenzhen, Guangdong, CN;
Inventors:
Assignee:
BYD Company Limited, Shenzhen, Guangdong, CN;
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); C08J 7/18 (2006.01); G21H 5/00 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/40 (2006.01); C08K 3/20 (2006.01); C23C 18/36 (2006.01); C23C 18/54 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1862 (2013.01); C08K 3/20 (2013.01); C23C 18/1603 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/1653 (2013.01); C23C 18/18 (2013.01); C23C 18/1851 (2013.01); C23C 18/204 (2013.01); C23C 18/40 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2262 (2013.01); C08K 2003/2265 (2013.01); C23C 18/1651 (2013.01); C23C 18/36 (2013.01); C23C 18/54 (2013.01);
Abstract
A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.