The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Aug. 10, 2017
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Daniel Robert Boughton, Naples, NY (US);

James Gerard Fagan, Painted Post, NY (US);

Sumalee Likitvanichkul Fagan, Painted Post, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 14/50 (2006.01); C23C 14/24 (2006.01); H02N 13/00 (2006.01); C03C 17/00 (2006.01); C03C 23/00 (2006.01); C03C 27/06 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C23C 14/50 (2013.01); C03C 17/002 (2013.01); C03C 23/0075 (2013.01); C03C 27/06 (2013.01); C23C 14/24 (2013.01); H01L 21/6715 (2013.01); H01L 21/6831 (2013.01); H01L 21/68785 (2013.01); H02N 13/00 (2013.01); C03C 2218/30 (2013.01);
Abstract

A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.


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