The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jul. 28, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 16/455 (2006.01); C23C 16/56 (2006.01); C23C 16/04 (2006.01); C23C 16/26 (2006.01); C23C 16/40 (2006.01); C23C 16/52 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
C23C 14/34 (2013.01); C23C 16/04 (2013.01); C23C 16/26 (2013.01); C23C 16/405 (2013.01); C23C 16/45525 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); G06T 7/0002 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/20056 (2013.01); G06T 2207/30144 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A method of analyzing growth of a two-dimensional material includes forming a two-dimensional material layer includes defects on a substrate, depositing detection material layers on the defects, and one of (i) capturing an image of the two-dimensional material layer on which the detection material layers are deposited and processing the captured image, or (ii) obtaining map coordinates of the detection material layers and processing the obtained map coordinates.