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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10138348 B1

PDFFull Text
Date of Patent:
Nov. 27, 2018

Filed:

Nov. 06, 2014

Resin composition and cured product thereof

Applicant:

Omron Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Seiji Nakajima, Moriyama, JP;

Yosuke Tatsuno, Kusatsu, JP;

Mitsuo Ito, Kikuchi-gun, JP;

Satoshi Hirono, Kusatsu, JP;

Yuzo Morisaki, Kusatsu, JP;

Junji Kawamoto, Kyoto, JP;

Assignee:

OMRON CORPORATION, Kyoto-shi, JP;

Attorney:

Metrolexis Law Group, PLLC

Primary Examiner:

Tae H Yoon

Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 7/20 (2006.01); C08L 63/02 (2006.01); C08J 3/24 (2006.01); C08G 59/18 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08K 3/22 (2006.01); C08K 5/3417 (2006.01); C08K 3/40 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); C08G 59/188 (2013.01); C08G 59/245 (2013.01); C08G 59/5033 (2013.01); C08G 59/686 (2013.01); C08J 3/241 (2013.01); C08K 3/013 (2018.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/40 (2013.01); C08K 5/3417 (2013.01); C08K 7/20 (2013.01); C08L 63/00 (2013.01); C08J 2363/02 (2013.01); C08K 2003/2265 (2013.01);
Abstract

The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Find Patent Forward Citations

Nakajima, Seiji. (2018). Resin composition and cured product thereof (U.S. Patent No. 10138348). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10138348

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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