The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Jun. 16, 2015
Applicant:

Water Mark Technologies, Inc., Lake Hopatcong, NJ (US);

Inventors:

Phillip B. Reilly, Jr., Andover, NJ (US);

Kimberly S. Logsdon, Chatham, NJ (US);

Phillip B. Reilly, III, Mendham, NJ (US);

Assignee:

Water Mark Technologies, Inc., Lake Hopatcong, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 43/26 (2006.01); C09K 8/68 (2006.01); C08J 3/20 (2006.01); C01F 7/47 (2006.01); C08J 3/12 (2006.01); C08K 3/16 (2006.01); C08K 5/098 (2006.01); C08K 3/26 (2006.01); C09K 8/80 (2006.01); C02F 11/14 (2006.01); C01F 7/06 (2006.01);
U.S. Cl.
CPC ...
C08J 3/203 (2013.01); C01F 7/066 (2013.01); C01F 7/47 (2013.01); C02F 11/14 (2013.01); C08J 3/12 (2013.01); C08K 3/16 (2013.01); C08K 3/26 (2013.01); C08K 5/098 (2013.01); C09K 8/68 (2013.01); C09K 8/80 (2013.01); C08J 2333/02 (2013.01); C08J 2333/26 (2013.01); C08K 2003/162 (2013.01); C08K 2003/262 (2013.01);
Abstract

Methods are provided for reducing friction during fracturing of a subterranean formation. In some embodiments, a method includes introducing micronized dry water soluble polymer (DWSP) particles into a fracturing liquid to form a mixture; and pumping the mixture into a subterranean formation to fracture the subterranean formation, the micronized DWSP particles include a DWSP, DWSP is selected from the group consisting of dry anionic, dry cationic, dry nonionic water soluble polymer, and mixtures thereof, mean particle size of the micronized DWSP particles ranges from about 115 to about 225 microns.


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