The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Dec. 19, 2013
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Claudia Hernandez, Lake Jackson, TX (US);

Nicolas C. Mazzola, Jundiai, BR;

Jozef J. Van Dun, Horgen, CH;

Kurt Brunner, Zurich, CH;

Maria Isabel Arroyo Villan, Tarragona, ES;

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01); B32B 27/32 (2006.01); B65D 65/38 (2006.01); B65D 75/28 (2006.01); B65D 75/58 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/327 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B65D 65/38 (2013.01); B65D 75/28 (2013.01); B65D 75/5855 (2013.01); C08J 5/18 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/31 (2013.01); B32B 2307/51 (2013.01); B32B 2307/72 (2013.01); B32B 2439/00 (2013.01); B32B 2439/40 (2013.01); B32B 2439/46 (2013.01); C08J 2323/06 (2013.01); C08J 2323/16 (2013.01); Y10T 428/1352 (2015.01); Y10T 428/24992 (2015.01); Y10T 428/249993 (2015.04); Y10T 428/264 (2015.01); Y10T 428/2826 (2015.01);
Abstract

The present disclosure is directed to compositions and film structures suitable for heat seal production. The heat sealable flexible film structure includes: a layer (A) comprising a propylene-based plastomer or elastomer ('PBPE') and a low density polyethylene; a layer (B), adjacent to layer (A), comprising at least 50 percent by weight of the layer (B) of an ethylene-based polymer; and an outermost layer (C) comprising a material having a melting point greater than 140° C. Weight percents are based on the total weight of the respective layer. The heat sealable flexible film structure is used to make a flexible container () having one or more heat seals (). The heat seal () can be a frangible heat seal, a hard heat seal, or a combination thereof.


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