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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10137661 B1

PDFFull Text
Date of Patent:
Nov. 27, 2018

Filed:

Apr. 04, 2014

Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body

Applicant:

Mitsubishi Rayon Co., Ltd., Chiyoda-ku, JP;

Inventors:

Tsuyoshi Takihara, Tokyo, JP;

Eiko Okamoto, Otake, JP;

Assignee:

Mitsubishi Chemical Corporation, Tokyo, JP;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Joanna Pleszczynska

Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B29C 33/42 (2006.01); B29C 45/16 (2006.01); B29C 51/02 (2006.01); B29C 37/00 (2006.01); G02B 1/118 (2015.01); B32B 27/36 (2006.01); B29C 45/14 (2006.01); B29L 31/00 (2006.01); B29C 51/14 (2006.01); B29K 33/04 (2006.01); B29K 69/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B29C 33/424 (2013.01); B29C 37/0032 (2013.01); B29C 45/1418 (2013.01); B29C 45/1679 (2013.01); B29C 51/02 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); G02B 1/118 (2013.01); B29C 51/14 (2013.01); B29C 2037/0042 (2013.01); B29K 2033/04 (2013.01); B29K 2069/00 (2013.01); B29K 2105/256 (2013.01); B29K 2995/0024 (2013.01); B29K 2995/0093 (2013.01); B29L 2031/756 (2013.01); B32B 2307/408 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2307/738 (2013.01); B32B 2451/00 (2013.01);
Abstract

A structural body which comprises a base and a microrelief structure layer having a microrelief structure. The microrelief structure layer is laminated on the base so as to form the surface layer of this structural body, and the microrelief structure layer has at least one physical property selected from the group consisting of (A) and (B) described below. (A) The elastic modulus at 25° C. is 50 MPa or more, and the elastic modulus at 80° C. is 30 MPa or less. (B) The tensile elongation at break at 80° C. is from 20% to 100% (inclusive).

Find Patent Forward Citations

Takihara, Tsuyoshi. (2018). Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body (U.S. Patent No. 10137661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10137661

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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