The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Jul. 12, 2016
Applicant:

Imra America, Inc., Ann Arbor, MI (US);

Inventors:

Michiharu Ota, Ann Arbor, MI (US);

Alan Y. Arai, Fremont, CA (US);

Zhenlin Liu, Ann Arbor, MI (US);

Assignee:

IMRA America, Inc., Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/38 (2014.01); B23K 26/0622 (2014.01); B23K 26/36 (2014.01); B23K 26/364 (2014.01); B23K 26/082 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 26/402 (2014.01); C03B 33/10 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0624 (2015.10); B23K 26/0604 (2013.01); B23K 26/082 (2015.10); B23K 26/36 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/382 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); C03B 33/102 (2013.01); B23K 2203/50 (2015.10); B23K 2203/54 (2015.10);
Abstract

In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.


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