The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Dec. 21, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventor:
Takashi Kanda, Kawasaki, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); B23K 1/00 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/367 (2006.01); H01L 23/15 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H01L 23/15 (2013.01); H01L 23/3731 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16251 (2013.01); H05K 1/0271 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09572 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/613 (2015.11);
Abstract
A semiconductor package includes: a first substrate, disposed so as to be opposed to a second substrate, on which a semiconductor chip is mounted; and a solder ball formed on the first substrate, wherein the solder ball is joined to a pin that penetrates through the second substrate.