The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Mar. 07, 2018
Applicant:

Omron Healthcare Co., Ltd., Kyoto, JP;

Inventors:

Noriko Shigihara, Kyoto, JP;

Yuki Kato, Kyoto, JP;

Masayuki Wakamiya, Kyoto, JP;

Toshihiko Ogura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); G01L 27/00 (2006.01); A61B 5/022 (2006.01); A61B 5/0245 (2006.01); A61B 5/02 (2006.01);
U.S. Cl.
CPC ...
A61B 5/6843 (2013.01); A61B 5/02 (2013.01); A61B 5/022 (2013.01); A61B 5/0245 (2013.01); G01L 27/002 (2013.01);
Abstract

A method for inspecting a pressure pulse wave sensor is provided. The sensor chip includes a recess which is recessed in a direction perpendicular to the pressure-sensitive face, and the pressure-sensitive element array is formed in a portion of the sensor chip whose thickness is reduced in the direction due to the recess. The method includes: bonding and fixing the sensor chip onto the substrate so that the recess communicates with atmospheric air through only the through hole of the substrate; connecting a substrate-side terminal portion of the substrate and the chip-side terminal portion through an electrically conductive member; and performing characteristic evaluation on the sensor chip based on a signal outputted from the substrate-side terminal portion in a state in which air is sucked through the through hole of the substrate to thereby apply negative pressure to the pressure-sensitive face.


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