The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
May. 22, 2015
Applicant:
Sharp Kabushiki Kaisha, Osaka, JP;
Inventors:
Katsuhiro Yamaguchi, Osaka, JP;
Nobuhiro Nakata, Osaka, JP;
Yukinori Masuda, Osaka, JP;
Tomoki Takahara, Osaka, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0469 (2013.01); G02F 1/13454 (2013.01); H01L 24/03 (2013.01); H01L 24/29 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 1/111 (2013.01); H05K 3/0055 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75312 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81234 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81466 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83234 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/10162 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15788 (2013.01);
Abstract
An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.